Thermal stress analysis of electronic packaging components

• المؤلف الرئيسي: See Toh, Chee Wai.
• مؤلفون آخرون: Pang, John Hock Lye
• التنسيق: Theses and Dissertations
• اللغة: English
• منشور في: 2008
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/13448

The stress and strain behaviour of surface-mounted electronic packaging components under temperature cycling fatigue and creep deformations was investigated by non-linear three dimensional finite element method. In this research, solder joints of a PQFP package with a corner lead and solder joints o...