Thermal stress analysis of electronic packaging components

Thermal stress analysis of electronic packaging components

The stress and strain behaviour of surface-mounted electronic packaging components under temperature cycling fatigue and creep deformations was investigated by non-linear three dimensional finite element method. In this research, solder joints of a PQFP package with a corner lead and solder joints o...

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Bibliographic Details
Main Author: See Toh, Chee Wai.
Other Authors: Pang, John Hock Lye
Format: Theses and Dissertations
Language:English
Published: 2008
Subjects:
DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
Online Access:http://hdl.handle.net/10356/13448
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Institution: Nanyang Technological University
Language: English
Description
Summary:The stress and strain behaviour of surface-mounted electronic packaging components under temperature cycling fatigue and creep deformations was investigated by non-linear three dimensional finite element method. In this research, solder joints of a PQFP package with a corner lead and solder joints of a CBGA package were studied.

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