A finite element study of stresses developed in plastic encapsulated electronic packages during leadframe pull-out testing
The objective of this project is to simulate the stresses developed in the epoxy encapsulated dummy integrated circuit package during leadframe pull-out testing. Finite element analyses are utilized to simulate the stresses developed due to free and constrained displacement boundary conditions, the...
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| 格式: | Theses and Dissertations |
| 語言: | English |
| 出版: |
2008
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| 主題: | |
| 在線閱讀: | http://hdl.handle.net/10356/13412 |
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| 機構: | Nanyang Technological University |
| 語言: | English |