Development of polymeric microelectronics packaging encapsulation for harsh environment applications

• Main Author: Phua, Eric Jian Rong
• Other Authors: Gan Chee Lip
• Format: Thesis-Doctor of Philosophy
• Language: English
• Published: Nanyang Technological University 2018
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
• Online Access: http://hdl.handle.net/10356/73226
• Institution: Nanyang Technological University

Epoxy has been the choice of mainstream polymer encapsulation in electronics packaging since the 1960s. Many present electronic applications require polymer materials which are stronger mechanically and functions at higher temperature due to increasing operation demands. Research was previously cond...