Development of polymeric microelectronics packaging encapsulation for harsh environment applications

by Phua, Eric Jian Rong
Published 2018

Simultaneous enhancement of polymerization kinetics and properties of phthalonitrile using alumina fillers

by Tay, Yu Shan, Phua, Eric Jian Rong, Chen, Zhong, Gan, Chee Lip
Published 2023

Novel high temperature polymeric encapsulation material for extreme environment electronics packaging

by Phua, Eric Jian Rong, Liu, Ming, Cho, Bokun, Liu, Qing, Amini, Shahrouz, Hu, Xiao, Gan, Chee Lip
Published 2019

Improved mechanical and thermomechanical properties of alumina substrate via iron doping

by Made, Riko I., Phua, Eric Jian Rong, Pramana, Stevin Snellius, Wong, Chee Cheong, Chen, Zhong, Gan, Chee Lip, Tok, Alfred Iing Yoong
Published 2013

High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material

by Loeblein, Manuela, Tsang, Siu Hon, Pawlik, Matthieu, Phua, Eric Jian Rong, Yong, Han, Zhang, Xiao Wu, Gan, Chee Lip, Teo, Edwin Hang Tong
Published 2017

A low-profile three-dimensional neural probe array using a silicon lead transfer structure

by Cheng, Ming-Yuan, Je, Minkyu, Tan, Kwan Ling, Tan, Ee Lim, Lim, Ruiqi, Yao, Lei, Li, Peng, Park, Woo-Tae, Phua, Eric Jian Rong, Gan, Chee Lip, Yu, Aibin
Published 2013

Study of metal additives to alumina ceramics substrate for high temperature and pressure application

by Made, Riko I., Phua, Eric Jian Rong, Sharif, Ahmed, Pramana, Stevin Snellius, Wong, Chee Cheong, Chen, Zhong, Nachiappan, Vivek Chidambaram, Ho, Beng Yeung, Gao, Shan, Tok, Alfred Iing Yoong
Published 2013