High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material

• Main Authors: Loeblein, Manuela, Tsang, Siu Hon, Pawlik, Matthieu, Phua, Eric Jian Rong, Yong, Han, Zhang, Xiao Wu, Gan, Chee Lip, Teo, Edwin Hang Tong
• Other Authors: School of Electrical and Electronic Engineering
• Format: Article
• Language: English
• Published: 2017
• Subjects: Three-dimensional h-BN; Three-dimensional graphene
• Online Access: https://hdl.handle.net/10356/84059; http://hdl.handle.net/10220/43558
• Institution: Nanyang Technological University

Compression studies on three-dimensional foam-like graphene and h-BN (3D-C and 3D-BN) revealed their high cross-plane thermal conductivity (62–86 W m–1 K–1) and excellent surface conformity, characteristics essential for thermal management needs. Comparative studies to state-of-the-art materials and...