High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material
Compression studies on three-dimensional foam-like graphene and h-BN (3D-C and 3D-BN) revealed their high cross-plane thermal conductivity (62–86 W m–1 K–1) and excellent surface conformity, characteristics essential for thermal management needs. Comparative studies to state-of-the-art materials and...
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sg-ntu-dr.10356-840592020-09-26T22:19:55Z High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material Loeblein, Manuela Tsang, Siu Hon Pawlik, Matthieu Phua, Eric Jian Rong Yong, Han Zhang, Xiao Wu Gan, Chee Lip Teo, Edwin Hang Tong School of Electrical and Electronic Engineering School of Materials Science & Engineering CNRS International NTU THALES Research Alliance Temasek Laboratories Three-dimensional h-BN Three-dimensional graphene Compression studies on three-dimensional foam-like graphene and h-BN (3D-C and 3D-BN) revealed their high cross-plane thermal conductivity (62–86 W m–1 K–1) and excellent surface conformity, characteristics essential for thermal management needs. Comparative studies to state-of-the-art materials and other materials currently under research for heat dissipation revealed 3D-foam’s improved performance (20–30% improved cooling, temperature decrease by ΔT of 44–24 °C). MOE (Min. of Education, S’pore) Accepted version 2017-08-07T04:22:28Z 2019-12-06T15:37:28Z 2017-08-07T04:22:28Z 2019-12-06T15:37:28Z 2017 Journal Article Loeblein, M., Tsang, S. H., Pawlik, M., Phua, E. J. R., Yong, H., Zhang, X. W., et al. (2017). High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material. ACS Nano, 11(2), 2033-2044. 1936-0851 https://hdl.handle.net/10356/84059 http://hdl.handle.net/10220/43558 10.1021/acsnano.6b08218 en ACS Nano © 2017 American Chemical Society. This is the author created version of a work that has been peer reviewed and accepted for publication by ACS Nano, American Chemical Society. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1021/acsnano.6b08218]. 32 p. application/pdf |
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Three-dimensional h-BN Three-dimensional graphene Loeblein, Manuela Tsang, Siu Hon Pawlik, Matthieu Phua, Eric Jian Rong Yong, Han Zhang, Xiao Wu Gan, Chee Lip Teo, Edwin Hang Tong High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material |
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Compression studies on three-dimensional foam-like graphene and h-BN (3D-C and 3D-BN) revealed their high cross-plane thermal conductivity (62–86 W m–1 K–1) and excellent surface conformity, characteristics essential for thermal management needs. Comparative studies to state-of-the-art materials and other materials currently under research for heat dissipation revealed 3D-foam’s improved performance (20–30% improved cooling, temperature decrease by ΔT of 44–24 °C). |
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School of Electrical and Electronic Engineering |
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School of Electrical and Electronic Engineering Loeblein, Manuela Tsang, Siu Hon Pawlik, Matthieu Phua, Eric Jian Rong Yong, Han Zhang, Xiao Wu Gan, Chee Lip Teo, Edwin Hang Tong |
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Article |
author |
Loeblein, Manuela Tsang, Siu Hon Pawlik, Matthieu Phua, Eric Jian Rong Yong, Han Zhang, Xiao Wu Gan, Chee Lip Teo, Edwin Hang Tong |
author_sort |
Loeblein, Manuela |
title |
High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material |
title_short |
High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material |
title_full |
High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material |
title_fullStr |
High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material |
title_full_unstemmed |
High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material |
title_sort |
high-density 3d-boron nitride and 3d-graphene for high-performance nano–thermal interface material |
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2017 |
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https://hdl.handle.net/10356/84059 http://hdl.handle.net/10220/43558 |
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1681059772887990272 |