High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material

Compression studies on three-dimensional foam-like graphene and h-BN (3D-C and 3D-BN) revealed their high cross-plane thermal conductivity (62–86 W m–1 K–1) and excellent surface conformity, characteristics essential for thermal management needs. Comparative studies to state-of-the-art materials and...

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Main Authors: Loeblein, Manuela, Tsang, Siu Hon, Pawlik, Matthieu, Phua, Eric Jian Rong, Yong, Han, Zhang, Xiao Wu, Gan, Chee Lip, Teo, Edwin Hang Tong
Other Authors: School of Electrical and Electronic Engineering
Format: Article
Language:English
Published: 2017
Subjects:
Online Access:https://hdl.handle.net/10356/84059
http://hdl.handle.net/10220/43558
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-840592020-09-26T22:19:55Z High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material Loeblein, Manuela Tsang, Siu Hon Pawlik, Matthieu Phua, Eric Jian Rong Yong, Han Zhang, Xiao Wu Gan, Chee Lip Teo, Edwin Hang Tong School of Electrical and Electronic Engineering School of Materials Science & Engineering CNRS International NTU THALES Research Alliance Temasek Laboratories Three-dimensional h-BN Three-dimensional graphene Compression studies on three-dimensional foam-like graphene and h-BN (3D-C and 3D-BN) revealed their high cross-plane thermal conductivity (62–86 W m–1 K–1) and excellent surface conformity, characteristics essential for thermal management needs. Comparative studies to state-of-the-art materials and other materials currently under research for heat dissipation revealed 3D-foam’s improved performance (20–30% improved cooling, temperature decrease by ΔT of 44–24 °C). MOE (Min. of Education, S’pore) Accepted version 2017-08-07T04:22:28Z 2019-12-06T15:37:28Z 2017-08-07T04:22:28Z 2019-12-06T15:37:28Z 2017 Journal Article Loeblein, M., Tsang, S. H., Pawlik, M., Phua, E. J. R., Yong, H., Zhang, X. W., et al. (2017). High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material. ACS Nano, 11(2), 2033-2044. 1936-0851 https://hdl.handle.net/10356/84059 http://hdl.handle.net/10220/43558 10.1021/acsnano.6b08218 en ACS Nano © 2017 American Chemical Society. This is the author created version of a work that has been peer reviewed and accepted for publication by ACS Nano, American Chemical Society. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1021/acsnano.6b08218]. 32 p. application/pdf
institution Nanyang Technological University
building NTU Library
country Singapore
collection DR-NTU
language English
topic Three-dimensional h-BN
Three-dimensional graphene
spellingShingle Three-dimensional h-BN
Three-dimensional graphene
Loeblein, Manuela
Tsang, Siu Hon
Pawlik, Matthieu
Phua, Eric Jian Rong
Yong, Han
Zhang, Xiao Wu
Gan, Chee Lip
Teo, Edwin Hang Tong
High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material
description Compression studies on three-dimensional foam-like graphene and h-BN (3D-C and 3D-BN) revealed their high cross-plane thermal conductivity (62–86 W m–1 K–1) and excellent surface conformity, characteristics essential for thermal management needs. Comparative studies to state-of-the-art materials and other materials currently under research for heat dissipation revealed 3D-foam’s improved performance (20–30% improved cooling, temperature decrease by ΔT of 44–24 °C).
author2 School of Electrical and Electronic Engineering
author_facet School of Electrical and Electronic Engineering
Loeblein, Manuela
Tsang, Siu Hon
Pawlik, Matthieu
Phua, Eric Jian Rong
Yong, Han
Zhang, Xiao Wu
Gan, Chee Lip
Teo, Edwin Hang Tong
format Article
author Loeblein, Manuela
Tsang, Siu Hon
Pawlik, Matthieu
Phua, Eric Jian Rong
Yong, Han
Zhang, Xiao Wu
Gan, Chee Lip
Teo, Edwin Hang Tong
author_sort Loeblein, Manuela
title High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material
title_short High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material
title_full High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material
title_fullStr High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material
title_full_unstemmed High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material
title_sort high-density 3d-boron nitride and 3d-graphene for high-performance nano–thermal interface material
publishDate 2017
url https://hdl.handle.net/10356/84059
http://hdl.handle.net/10220/43558
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