RF MEMs devices development for telecommunications

by Liu, Ai Qun, Yu, Aibin, Tang, Min, Muhammad Faeyz Karim, Zhang, Xinjun, Win Palei
Published 2008

Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications

by Lau, John H., Made, Riko I., Gan, Chee Lip, Yan, Li Ling, Yu, Aibin, Yoon, Seung Wook, Lee, Chengkuo
Published 2011

A flexible polyimide cable for implantable neural probe arrays

by Cheng, Ming-Yuan, Park, Woo-Tae, Yu, Aibin, Xue, Rui-Feng, Tan, Kwan Ling, Yu, Daquan, Lee, Sang-Hyun, Gan, Chee Lip, Je, Minkyu
Published 2013

A low-profile three-dimensional neural probe array using a silicon lead transfer structure

by Cheng, Ming-Yuan, Je, Minkyu, Tan, Kwan Ling, Tan, Ee Lim, Lim, Ruiqi, Yao, Lei, Li, Peng, Park, Woo-Tae, Phua, Eric Jian Rong, Gan, Chee Lip, Yu, Aibin
Published 2013