Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications

• المؤلفون الرئيسيون: Lau, John H., Made, Riko I., Gan, Chee Lip, Yan, Li Ling, Yu, Aibin, Yoon, Seung Wook, Lee, Chengkuo
• مؤلفون آخرون: School of Materials Science & Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2011
• الموضوعات: DRNTU::Engineering::Materials::Electronic packaging materials; DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/94437; http://hdl.handle.net/10220/7261
• المؤسسة: Nanyang Technological University

Low-temperature solders have wide applications in integrated circuits and micro-electromechanical systems packaging. In this article, a study on Ag-In solder for chip-to-chip thermocompression bonding was carried out. The resulting joint consists of AgIn2 and Ag9In4 phases, with the latter...