Interfacial study of electroless Ni-Sn-P plating and Sn-3.5Ag solder after multiple reflows

• المؤلف الرئيسي: Sumboja, Afriyanti.
• مؤلفون آخرون: Chen Zhong
• التنسيق: Final Year Project
• اللغة: English
• منشور في: 2009
• الموضوعات: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/15307
• المؤسسة: Nanyang Technological University

Electroless Ni-P plating has been a good candidate for Under Bump Metallization (UBM) in IC packaging due to its lower cost and slower chemical reaction with solder compared to Cu based UBM. However, during its reaction with Sn-based lead free solder, it faces the problem of rapid Ni out diffusion w...