Fracture properties of Sn-37Pb and Sn-3.5Ag solder joints

• المؤلف الرئيسي: Siow, Kim Shyong.
• مؤلفون آخرون: Manoharan, Mohan
• التنسيق: Theses and Dissertations
• اللغة: English
• منشور في: 2008
• الموضوعات: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/13538
• المؤسسة: Nanyang Technological University

Surface mount technology has increasingly become the industry norm and slowly replaced the pin through hole technique. This preference has led to a demand for higher quality solder joints. Besides the traditional role as an electrical connection, the joint needs to be able to act as a load bearing e...