Development of Pb-free solder for electronic assembly

• Main Author: Li, Guoyuan.
• Other Authors: School of Materials Science & Engineering
• Format: Research Report
• Published: 2008
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
• Online Access: http://hdl.handle.net/10356/6781
• Institution: Nanyang Technological University

This project aimed (1) to look for new lead-free solder alloy systems with improved properties for electronic packaging and assembly, (2) to study the effects of microstructural evolution on the reliability of the solder joints, and (3) to investigate the growth kinetics of the IMC formation in sold...