Study of interfacial reaction between Cu and Pb-free solders and rapid temperature cycling methodology for reliability assessment

The global objective of this research endeavor is to inhibit the excessive growth of IMC and improve the properties of Sn-Ag-Cu lead-free solder alloy by adding small mount of Sb.

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Bibliographic Details
Main Author: Chen, Binling
Other Authors: Li Guoyuan
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:https://hdl.handle.net/10356/5076
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Institution: Nanyang Technological University