Study of interfacial reaction between Cu and Pb-free solders and rapid temperature cycling methodology for reliability assessment

• Main Author: Chen, Binling
• Other Authors: Li Guoyuan
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
• Online Access: https://hdl.handle.net/10356/5076
• Institution: Nanyang Technological University

The global objective of this research endeavor is to inhibit the excessive growth of IMC and improve the properties of Sn-Ag-Cu lead-free solder alloy by adding small mount of Sb.