Effects of interfacial reactions and electromigration on the Cu/electroless Ni-P/Sn-3.5Ag solder joint strength

• المؤلف الرئيسي: Aditya Kumar
• مؤلفون آخرون: V. Kripesh
• التنسيق: Theses and Dissertations
• منشور في: 2008
• الموضوعات: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/5119

In this work, the effects of interfacial reactions and electromigration on the mechanical behavior of Cu/electroless Ni-P/Sn-3.5Ag solder joint were investigated. For a complete understanding, several process and material parameters, such as aging temperature, aging duration, Ni-P thickness, P conce...