Effects of interfacial reactions and electromigration on the Cu/electroless Ni-P/Sn-3.5Ag solder joint strength

Effects of interfacial reactions and electromigration on the Cu/electroless Ni-P/Sn-3.5Ag solder joint strength

In this work, the effects of interfacial reactions and electromigration on the mechanical behavior of Cu/electroless Ni-P/Sn-3.5Ag solder joint were investigated. For a complete understanding, several process and material parameters, such as aging temperature, aging duration, Ni-P thickness, P conce...

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Main Author: Aditya Kumar
Other Authors: V. Kripesh
Format: Theses and Dissertations
Published: 2008
Subjects:
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Online Access:https://hdl.handle.net/10356/5119
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Institution: Nanyang Technological University
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spelling sg-ntu-dr.10356-51192020-06-01T11:56:49Z Effects of interfacial reactions and electromigration on the Cu/electroless Ni-P/Sn-3.5Ag solder joint strength Aditya Kumar V. Kripesh Chen Zhong School of Materials Science & Engineering DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects In this work, the effects of interfacial reactions and electromigration on the mechanical behavior of Cu/electroless Ni-P/Sn-3.5Ag solder joint were investigated. For a complete understanding, several process and material parameters, such as aging temperature, aging duration, Ni-P thickness, P concentration of Ni-P, and electric current density were varied systematically and their effect was studied on the solder joint strength. DOCTOR OF PHILOSOPHY (SME) 2008-09-17T10:20:28Z 2008-09-17T10:20:28Z 2007 2007 Thesis Aditya, K. (2007). Effects of interfacial reactions and electromigration on the Cu/electroless Ni-P/Sn-3.5Ag solder joint strength. Doctoral thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/5119 10.32657/10356/5119 Nanyang Technological University 220 p. application/pdf
institution Nanyang Technological University
building NTU Library
country Singapore
collection DR-NTU
topic DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
spellingShingle DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Aditya Kumar
Effects of interfacial reactions and electromigration on the Cu/electroless Ni-P/Sn-3.5Ag solder joint strength
description In this work, the effects of interfacial reactions and electromigration on the mechanical behavior of Cu/electroless Ni-P/Sn-3.5Ag solder joint were investigated. For a complete understanding, several process and material parameters, such as aging temperature, aging duration, Ni-P thickness, P concentration of Ni-P, and electric current density were varied systematically and their effect was studied on the solder joint strength.
author2 V. Kripesh
author_facet V. Kripesh
Aditya Kumar
format Theses and Dissertations
author Aditya Kumar
author_sort Aditya Kumar
title Effects of interfacial reactions and electromigration on the Cu/electroless Ni-P/Sn-3.5Ag solder joint strength
title_short Effects of interfacial reactions and electromigration on the Cu/electroless Ni-P/Sn-3.5Ag solder joint strength
title_full Effects of interfacial reactions and electromigration on the Cu/electroless Ni-P/Sn-3.5Ag solder joint strength
title_fullStr Effects of interfacial reactions and electromigration on the Cu/electroless Ni-P/Sn-3.5Ag solder joint strength
title_full_unstemmed Effects of interfacial reactions and electromigration on the Cu/electroless Ni-P/Sn-3.5Ag solder joint strength
title_sort effects of interfacial reactions and electromigration on the cu/electroless ni-p/sn-3.5ag solder joint strength
publishDate 2008
url https://hdl.handle.net/10356/5119
_version_ 1681057001642131456

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