Effects of interfacial reactions and electromigration on the Cu/electroless Ni-P/Sn-3.5Ag solder joint strength

In this work, the effects of interfacial reactions and electromigration on the mechanical behavior of Cu/electroless Ni-P/Sn-3.5Ag solder joint were investigated. For a complete understanding, several process and material parameters, such as aging temperature, aging duration, Ni-P thickness, P conce...

Full description

Saved in:

Bibliographic Details
Main Author:	Aditya Kumar
Other Authors:	V. Kripesh
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Online Access:	https://hdl.handle.net/10356/5119
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	Nanyang Technological University

Description
Summary:	In this work, the effects of interfacial reactions and electromigration on the mechanical behavior of Cu/electroless Ni-P/Sn-3.5Ag solder joint were investigated. For a complete understanding, several process and material parameters, such as aging temperature, aging duration, Ni-P thickness, P concentration of Ni-P, and electric current density were varied systematically and their effect was studied on the solder joint strength.

Effects of interfacial reactions and electromigration on the Cu/electroless Ni-P/Sn-3.5Ag solder joint strength

Similar Items