Effects of interfacial reactions and electromigration on the Cu/electroless Ni-P/Sn-3.5Ag solder joint strength
In this work, the effects of interfacial reactions and electromigration on the mechanical behavior of Cu/electroless Ni-P/Sn-3.5Ag solder joint were investigated. For a complete understanding, several process and material parameters, such as aging temperature, aging duration, Ni-P thickness, P conce...
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Main Author: | Aditya Kumar |
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Other Authors: | V. Kripesh |
Format: | Theses and Dissertations |
Published: |
2008
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/5119 |
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Institution: | Nanyang Technological University |
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