Fine pitch packaging study of CU or low-k devices

• المؤلف الرئيسي: Ong, Xuefen.
• مؤلفون آخرون: Chen Zhong
• التنسيق: Theses and Dissertations
• اللغة: English
• منشور في: 2009
• الموضوعات: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/14975
• المؤسسة: Nanyang Technological University

The main objective of this project is to improve and enhance the reliability performance of Cu / low-k flip chip ball grid array packages. This project is divided into three parts. The first part of the project involved developing an underfill selection methodology that enable researchers to screen...