Fine pitch packaging study of CU or low-k devices

The main objective of this project is to improve and enhance the reliability performance of Cu / low-k flip chip ball grid array packages. This project is divided into three parts. The first part of the project involved developing an underfill selection methodology that enable researchers to screen...

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Bibliographic Details
Main Author: Ong, Xuefen.
Other Authors: Chen Zhong
Format: Theses and Dissertations
Language:English
Published: 2009
Subjects:
Online Access:http://hdl.handle.net/10356/14975
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Institution: Nanyang Technological University
Language: English