Characterization, interaction and failure analysis of lead-free solder bump interconnects

• المؤلف الرئيسي: Thong, Chee Meng.
• مؤلفون آخرون: Li, Guoyuan
• التنسيق: Theses and Dissertations
• منشور في: 2008
• الموضوعات: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/5113
• المؤسسة: Nanyang Technological University

Environmental legislation and the continuing industrial drive for further miniaturization and improved performance place over increasing demands on electronic packaging materials. The development of new lead-free solder alloys and associated materials to meet the requirements of the next generation...