Characterization, interaction and failure analysis of lead-free solder bump interconnects
Environmental legislation and the continuing industrial drive for further miniaturization and improved performance place over increasing demands on electronic packaging materials. The development of new lead-free solder alloys and associated materials to meet the requirements of the next generation...
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/5113 |
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| Institution: | Nanyang Technological University |