Hydrostatic stress and hydrostatic stress gradients in passivated copper interconnects

• المؤلفون الرئيسيون: Ang, Derrick, Ramanujan, Raju V.
• مؤلفون آخرون: School of Materials Science & Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2011
• الموضوعات: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/94245; http://hdl.handle.net/10220/7255
• المؤسسة: Nanyang Technological University

A numerical evaluation of the effects of geometrical factors on the hydrostatic stress and hydrostatic stress gradients in passivated copper interconnects was performed. These values were correlated with experimental values in the literature on the location of voids in the interconnect. Copper inter...