Electromigration reliability study on copper interconnects under pulsed current conditions

• 主要作者: Lim, Meng Keong
• 其他作者: Gan Chee Lip
• 格式: Theses and Dissertations
• 語言: English
• 出版: 2015
• 主題: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
• 在線閱讀: http://hdl.handle.net/10356/65236
• 機構: Nanyang Technological University

Although most interconnects carry pulsed current signals during field operations, most of our understanding on electromigration has been obtained from direct current (D.C.) studies. As continuous scaling has demanded interconnects to carry higher current density and achieve lower failure rate with e...