Electromigration reliability study on copper interconnects under pulsed current conditions

• Main Author: Lim, Meng Keong
• Other Authors: Gan Chee Lip
• Format: Theses and Dissertations
• Language: English
• Published: 2015
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
• Online Access: http://hdl.handle.net/10356/65236
• Institution: Nanyang Technological University

Although most interconnects carry pulsed current signals during field operations, most of our understanding on electromigration has been obtained from direct current (D.C.) studies. As continuous scaling has demanded interconnects to carry higher current density and achieve lower failure rate with e...