Experimental and theoretical study of nanotwinned copper fabricated by pulse-reverse electrodeposition for interconnect and through-silicon via (TSV) technologies

• Main Author: Lin, Nay
• Other Authors: Miao Jianmin
• Format: Theses and Dissertations
• Language: English
• Published: 2014
• Subjects: DRNTU::Engineering::Materials::Electronic packaging materials; DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
• Online Access: https://hdl.handle.net/10356/58947
• Institution: Nanyang Technological University

Through-silicon via (TSV) copper interconnects of varying sizes and aspect ratios are fabricated using pulse and pulse-reversed electrodeposition techniques in deep reactive ion etched silicon vias. Mechanical properties of fabricated TSV are characterized by nanoindentation. The measurements show t...