Study on diffusion barriers for multilevel interconnect in advanced semiconductor devices

• Main Author: Lim, Boon Kiat.
• Other Authors: Park, Hun Sub
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
• Online Access: http://hdl.handle.net/10356/5077
• Institution: Nanyang Technological University

Since the advent of microelectronics and wafer fabrication, the need for diffusion barriers/adhesion promoters in interconnect systems to enhance mechanical stability and prevent interdiffusion has emerged. This studey investigated the integrity of TiN diffusion barriers in A1 interconnect system.