Study on diffusion barriers for multilevel interconnect in advanced semiconductor devices

Since the advent of microelectronics and wafer fabrication, the need for diffusion barriers/adhesion promoters in interconnect systems to enhance mechanical stability and prevent interdiffusion has emerged. This studey investigated the integrity of TiN diffusion barriers in A1 interconnect system.

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Bibliographic Details
Main Author:	Lim, Boon Kiat.
Other Authors:	Park, Hun Sub
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Online Access:	http://hdl.handle.net/10356/5077
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-5077
record_format	dspace
spelling	sg-ntu-dr.10356-50772023-03-04T16:34:20Z Study on diffusion barriers for multilevel interconnect in advanced semiconductor devices Lim, Boon Kiat. Park, Hun Sub School of Materials Science & Engineering DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects Since the advent of microelectronics and wafer fabrication, the need for diffusion barriers/adhesion promoters in interconnect systems to enhance mechanical stability and prevent interdiffusion has emerged. This studey investigated the integrity of TiN diffusion barriers in A1 interconnect system. Doctor of Philosophy (SME) 2008-09-17T10:19:23Z 2008-09-17T10:19:23Z 2004 2004 Thesis http://hdl.handle.net/10356/5077 Nanyang Technological University 149 p. application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
spellingShingle	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects Lim, Boon Kiat. Study on diffusion barriers for multilevel interconnect in advanced semiconductor devices
description	Since the advent of microelectronics and wafer fabrication, the need for diffusion barriers/adhesion promoters in interconnect systems to enhance mechanical stability and prevent interdiffusion has emerged. This studey investigated the integrity of TiN diffusion barriers in A1 interconnect system.
author2	Park, Hun Sub
author_facet	Park, Hun Sub Lim, Boon Kiat.
format	Theses and Dissertations
author	Lim, Boon Kiat.
author_sort	Lim, Boon Kiat.
title	Study on diffusion barriers for multilevel interconnect in advanced semiconductor devices
title_short	Study on diffusion barriers for multilevel interconnect in advanced semiconductor devices
title_full	Study on diffusion barriers for multilevel interconnect in advanced semiconductor devices
title_fullStr	Study on diffusion barriers for multilevel interconnect in advanced semiconductor devices
title_full_unstemmed	Study on diffusion barriers for multilevel interconnect in advanced semiconductor devices
title_sort	study on diffusion barriers for multilevel interconnect in advanced semiconductor devices
publishDate	2008
url	http://hdl.handle.net/10356/5077
_version_	1759855895173398528

Study on diffusion barriers for multilevel interconnect in advanced semiconductor devices

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