Showing 1 - 6 results of 6 for search 'Park, Hun Sub', query time: 0.01s Refine Results
2
Study on diffusion barriers for multilevel interconnect in advanced semiconductor devices
by Lim, Boon Kiat.
Published 2008
Other Authors: “...Park, Hun Sub...”
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3
Chemical mechanical polishing process of copper metallization in the ULSI devices
by Leow, Nelson Whatt Wei.
Published 2008
Other Authors: “...Park, Hun Sub...”
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4
Study on copper electromigration reliability of the ULSI devices
by Low, Joon Kiat.
Published 2008
Other Authors: “...Park, Hun Sub...”
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5
Electromigration behaviour of copper metal lines in ULSI devices
by Ong, Sock Meng.
Published 2008
Other Authors: “...Park, Hun Sub...”
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6
Investigation on the formation of C54-TiSi2 used as contact metallization in ULSI application
by Zhang, Lin
Published 2008
Other Authors: “...Park, Hun Sub...”
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