Chemical mechanical polishing process of copper metallization in the ULSI devices

• Main Author: Leow, Nelson Whatt Wei.
• Other Authors: Park, Hun Sub
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
• Online Access: http://hdl.handle.net/10356/5072
• Institution: Nanyang Technological University

Explore techniques capable of reducing Cu dishing significantly. All techniques studied will focus on minimizing both topology and Cu interconnect sheet resistance. Factors affecting Cu removal and hence topology would also be investigated.