Study on diffusion barriers for multilevel interconnect in advanced semiconductor devices

Since the advent of microelectronics and wafer fabrication, the need for diffusion barriers/adhesion promoters in interconnect systems to enhance mechanical stability and prevent interdiffusion has emerged. This studey investigated the integrity of TiN diffusion barriers in A1 interconnect system.

Saved in:
Bibliographic Details
Main Author: Lim, Boon Kiat.
Other Authors: Park, Hun Sub
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/5077
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Nanyang Technological University
Be the first to leave a comment!
You must be logged in first