Electroplating of copper metallization of sub-micron integrated circuits

• المؤلف الرئيسي: Law, Shao Beng.
• مؤلفون آخرون: Mridha, S.
• التنسيق: Theses and Dissertations
• منشور في: 2008
• الموضوعات: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/5067
• المؤسسة: Nanyang Technological University

In this project, plating in electrolytes with and without additives was evaluated. The impact of these electrolytes and various plating parameters such as current density, current pulse waveforms, wafer rotation on the characteristics of the plated Cu film were studied.