Electroplating of copper metallization of sub-micron integrated circuits

• 主要作者: Law, Shao Beng.
• 其他作者: Mridha, S.
• 格式: Theses and Dissertations
• 出版: 2008
• 主題: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
• 在線閱讀: http://hdl.handle.net/10356/5067

In this project, plating in electrolytes with and without additives was evaluated. The impact of these electrolytes and various plating parameters such as current density, current pulse waveforms, wafer rotation on the characteristics of the plated Cu film were studied.