Electroplating of copper metallization of sub-micron integrated circuits

In this project, plating in electrolytes with and without additives was evaluated. The impact of these electrolytes and various plating parameters such as current density, current pulse waveforms, wafer rotation on the characteristics of the plated Cu film were studied.

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Bibliographic Details
Main Author:	Law, Shao Beng.
Other Authors:	Mridha, S.
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Online Access:	http://hdl.handle.net/10356/5067
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-5067
record_format	dspace
spelling	sg-ntu-dr.10356-50672023-03-04T16:31:26Z Electroplating of copper metallization of sub-micron integrated circuits Law, Shao Beng. Mridha, S. School of Materials Science & Engineering DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects In this project, plating in electrolytes with and without additives was evaluated. The impact of these electrolytes and various plating parameters such as current density, current pulse waveforms, wafer rotation on the characteristics of the plated Cu film were studied. Master of Engineering (SME) 2008-09-17T10:19:03Z 2008-09-17T10:19:03Z 2001 2001 Thesis http://hdl.handle.net/10356/5067 Nanyang Technological University 156 p. application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
spellingShingle	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects Law, Shao Beng. Electroplating of copper metallization of sub-micron integrated circuits
description	In this project, plating in electrolytes with and without additives was evaluated. The impact of these electrolytes and various plating parameters such as current density, current pulse waveforms, wafer rotation on the characteristics of the plated Cu film were studied.
author2	Mridha, S.
author_facet	Mridha, S. Law, Shao Beng.
format	Theses and Dissertations
author	Law, Shao Beng.
author_sort	Law, Shao Beng.
title	Electroplating of copper metallization of sub-micron integrated circuits
title_short	Electroplating of copper metallization of sub-micron integrated circuits
title_full	Electroplating of copper metallization of sub-micron integrated circuits
title_fullStr	Electroplating of copper metallization of sub-micron integrated circuits
title_full_unstemmed	Electroplating of copper metallization of sub-micron integrated circuits
title_sort	electroplating of copper metallization of sub-micron integrated circuits
publishDate	2008
url	http://hdl.handle.net/10356/5067
_version_	1759853525170388992

Electroplating of copper metallization of sub-micron integrated circuits

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