Study of electromigration-induced voiding mechanisms in Cu interconnects

Study of electromigration-induced voiding mechanisms in Cu interconnects

150 p.

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Bibliographic Details
Main Author: Anand Vishwanath Vairagar
Other Authors: Ahila Krishnamoorthy
Format: Theses and Dissertations
Published: 2010
Subjects:
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Online Access:https://hdl.handle.net/10356/35952
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Institution: Nanyang Technological University

Internet

https://hdl.handle.net/10356/35952

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