Evaluation of process requirements for room temperature direct copper bonding

• Main Author: Chen, Qiang.
• Other Authors: Wong Chee Cheong
• Format: Final Year Project
• Language: English
• Published: 2009
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
• Online Access: http://hdl.handle.net/10356/20415
• Institution: Nanyang Technological University

Direct metal bonding is a method of joining two metal surfaces under ambient conditions without an intermediate layer in between. In this thesis, by coating the copper surface with a self assembled monolayer of alkanethiol prior to bonding, Cu joints can be successfully formed at room temperature in...