Characterization, interaction and failure analysis of lead-free solder bump interconnects

• Main Author: Thong, Chee Meng.
• Other Authors: Li, Guoyuan
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
• Online Access: http://hdl.handle.net/10356/5113
• Institution: Nanyang Technological University

Environmental legislation and the continuing industrial drive for further miniaturization and improved performance place over increasing demands on electronic packaging materials. The development of new lead-free solder alloys and associated materials to meet the requirements of the next generation...