Effect of electromigration on interfacial reactions between electroless Ni-P and Sn–3.5% Ag solder

• Main Authors: Kumar, A., Teo, P. S., He, Min, Chen, Zhong
• Other Authors: School of Materials Science & Engineering
• Format: Article
• Language: English
• Published: 2012
• Subjects: DRNTU::Engineering::Materials
• Online Access: https://hdl.handle.net/10356/94742; http://hdl.handle.net/10220/8154
• Institution: Nanyang Technological University

Effect of electromigration on interfacial reactions between electroless Ni–P (EL-Ni) and eutectic Sn–3.5% Ag solder has been investigated. Sandwich-type reaction couples, Cu/EL-Ni/Sn–3.5% Ag/EL-Ni/Cu, having two EL-Ni/Sn–3.5% Ag interfaces were prepared with the help of reflow process. During reflow...