Study of the interfaces between electroless nickel under bump metallization and lead-free solders

بواسطة He, Min.
منشور في 2008

Chemokines as therapeutic targets in systematic inflammatory response syndrome

بواسطة HE MIN
منشور في 2010

Morphology and kinetic study of the interfacial reaction between the Sn-3.5Ag solder and electroless Ni-P metallization

بواسطة Chen, Zhong, He, Min, Qi, Guojun
منشور في 2013

Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization

بواسطة He, Min, Chen, Zhong, Qi, Guojun
منشور في 2012

Mechanical strength of thermally aged Sn-3.5Ag/Ni-P solder joints

بواسطة He, Min, Chen, Zhong, Qi, Guojun
منشور في 2012

Barrier properties of thin Au/Ni–P under bump metallization for Sn–3.5Ag solder

بواسطة Kumar, Aditya, He, Min, Chen, Zhong
منشور في 2013

Effect of electromigration on interfacial reactions between electroless Ni-P and Sn–3.5% Ag solder

بواسطة Kumar, A., Teo, P. S., He, Min, Chen, Zhong
منشور في 2012

Elasticity modulus, hardness and fracture toughness of Ni3Sn4 intermetallic thin films

بواسطة Chen, Zhong, He, Min, Balakrisnan, Bavani, Chum, Chan Choy
منشور في 2012

Intermetallic compound formation between Sn–3.5Ag solder and Ni-based metallization during liquid state reaction

بواسطة He, Min, Lau, Wee Hua, Qi, Guojun, Chen, Zhong
منشور في 2012

Interfacial reaction between Sn-rich solders and Ni-based metallization

بواسطة Kumar, A., Yeo, P. T., He, Min, Qi, Guojun, Chen, Zhong
منشور في 2012

Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallization

بواسطة He, Min, Chen, Zhong, Qi, Guojun, Wong, Chee C., Mhaisalkar, Subodh Gautam
منشور في 2012

Investigating the effects of solid surfaces on ice nucleation

بواسطة Li, Kaiyong, Xu, Shun, Shi, Wenxiong, He, Min, Li, Huiling, Li, Shuzhou, Zhou, Xin, Wang, Jianjun, Song, Yanlin
منشور في 2013