The effect of aspect ratio scaling on hydrostatic stress in passivated interconnects

by Ang, Derrick, Wong, Chee C., Ramanujan, Raju V.
Published 2011

Effect of chain length on low temperature gold-gold bonding by self assembled monolayers

by Ang, X. F., Chen, Z., Wong, Chee C., Wei, J.
Published 2012

Effect of plating parameters on the intrinsic stress in electroless nickel plating

by Chen, Zhong, Xu, Xiaoda, Wong, Chee C., Mhaisalkar, Subodh Gautam
Published 2012

Effect of electromigration on the mechanical performance of Sn-3.5Ag solder joints with Ni and Ni-P metallizations

by Kumar, Aditya, Yang, Ying, Wong, Chee C., Kripesh, Vaidhyanathan, Chen, Zhong
Published 2013

Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallization

by He, Min, Chen, Zhong, Qi, Guojun, Wong, Chee C., Mhaisalkar, Subodh Gautam
Published 2012

Critical temperatures in thermocompression gold stud bonding

by Zhang, G. G., Ang, X. F., Chen, Z., Wong, Chee C., Wei, J.
Published 2012

Self-assembled monolayers for reduced temperature direct metal thermocompression bonding

by Ang, X. F., Li, F. Y., Tan, W. L., Chen, Z., Wong, Chee C., Wei, J.
Published 2012

Pulse electroplating of copper film : a study of process and microstructure

by Zhang, X., Tu, K. N., Chen, Z., Tan, Y. K., Wong, Chee C., Mhaisalkar, Subodh Gautam, Li, X. M., Tung, Chih Hang, Cheng, C. K.
Published 2012