Morphology and kinetic study of the interfacial reaction between the Sn-3.5Ag solder and electroless Ni-P metallization

by Chen, Zhong, He, Min, Qi, Guojun
Published 2013

Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization

by He, Min, Chen, Zhong, Qi, Guojun
Published 2012

Mechanical strength of thermally aged Sn-3.5Ag/Ni-P solder joints

by He, Min, Chen, Zhong, Qi, Guojun
Published 2012

Effect of interfacial reaction on the tensile strength of Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P solder joints

by Qi, Guojun, Chen, Z., He, M., Kumar, A.
Published 2013

Intermetallic compound formation between Sn–3.5Ag solder and Ni-based metallization during liquid state reaction

by He, Min, Lau, Wee Hua, Qi, Guojun, Chen, Zhong
Published 2012

Interfacial reaction between Sn-rich solders and Ni-based metallization

by Kumar, A., Yeo, P. T., He, Min, Qi, Guojun, Chen, Zhong
Published 2012

Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallization

by He, Min, Chen, Zhong, Qi, Guojun, Wong, Chee C., Mhaisalkar, Subodh Gautam
Published 2012

Electret mechanism, hysteresis, and ambient performance of sol-gel silica gate dielectrics in pentacene field-effect transistors

by Cahyadi, Tommy, Tan, H. S., Mhaisalkar, Subodh Gautam, Lee, Pooi See, Boey, Freddy Yin Chiang, Chen, Z. K., Ng, C. M., Rao, V. R., Qi, Guojun
Published 2012