Mechanical strength of thermally aged Sn-3.5Ag/Ni-P solder joints

• المؤلفون الرئيسيون: He, Min, Chen, Zhong, Qi, Guojun
• مؤلفون آخرون: School of Materials Science & Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2012
• الموضوعات: DRNTU::Engineering::Materials
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/94806; http://hdl.handle.net/10220/8158

This work presents an investigation on the influence of the solder/under bump metallization (UBM) interfacial reaction to the tensile strength and fracture behavior of Sn-3.5Ag/Ni-P solder joints under different thermal aging conditions. The tensile strength of Sn-3.5Ag/Ni-P solder joints decreases...