Mechanical strength of thermally aged Sn-3.5Ag/Ni-P solder joints

This work presents an investigation on the influence of the solder/under bump metallization (UBM) interfacial reaction to the tensile strength and fracture behavior of Sn-3.5Ag/Ni-P solder joints under different thermal aging conditions. The tensile strength of Sn-3.5Ag/Ni-P solder joints decreases...

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Main Authors: He, Min, Chen, Zhong, Qi, Guojun
Other Authors: School of Materials Science & Engineering
Format: Article
Language:English
Published: 2012
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Online Access:https://hdl.handle.net/10356/94806
http://hdl.handle.net/10220/8158
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-948062023-07-14T15:53:17Z Mechanical strength of thermally aged Sn-3.5Ag/Ni-P solder joints He, Min Chen, Zhong Qi, Guojun School of Materials Science & Engineering DRNTU::Engineering::Materials This work presents an investigation on the influence of the solder/under bump metallization (UBM) interfacial reaction to the tensile strength and fracture behavior of Sn-3.5Ag/Ni-P solder joints under different thermal aging conditions. The tensile strength of Sn-3.5Ag/Ni-P solder joints decreases with aging temperature and duration. Four types of failure modes have been identified. The failure modes shift from the bulk solder failure mode in the as-soldered condition toward the interfacial failure modes. Kirkendall voids do not appear to affect the tensile strength of the joint. The volume change of Ni-P phase transformation during the thermal aging process generates high tensile stress inside the Ni-P layer; this stress causes mudflat cracks on the remaining Ni-P coating and also leads to its delamination from the underlying Ni substrate. In general, interfacial reaction and the subsequent growth of Ni3Sn4 intermetallic compound (IMC) layer during solid-state reaction are the main reasons for the decrease of tensile strength of the solder joints. The current study finds there is an empirical linear relation between the solder joint strength and the Ni3Sn4 intermetallic compound (IMC) thickness. Therefore, the IMC thickness may be used as an indication of the joint strength. Accepted version 2012-05-28T08:59:15Z 2019-12-06T19:02:37Z 2012-05-28T08:59:15Z 2019-12-06T19:02:37Z 2005 2005 Journal Article He, M., Chen, Z., & Qi, G. (2005). Mechanical strength of thermally aged Sn-3.5Ag/Ni-P solder joints. Metallurgical and Materials Transactions A, 36(1), 65-75. https://hdl.handle.net/10356/94806 http://hdl.handle.net/10220/8158 10.1007/s11661-005-0139-7 en Metallurgical and materials transactions A © 2005 Springer. This is the author created version of a work that has been peer reviewed and accepted for publication by Metallurgical and Materials Transactions A, Springer. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1007/s11661-005-0139-7]. 42 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Materials
spellingShingle DRNTU::Engineering::Materials
He, Min
Chen, Zhong
Qi, Guojun
Mechanical strength of thermally aged Sn-3.5Ag/Ni-P solder joints
description This work presents an investigation on the influence of the solder/under bump metallization (UBM) interfacial reaction to the tensile strength and fracture behavior of Sn-3.5Ag/Ni-P solder joints under different thermal aging conditions. The tensile strength of Sn-3.5Ag/Ni-P solder joints decreases with aging temperature and duration. Four types of failure modes have been identified. The failure modes shift from the bulk solder failure mode in the as-soldered condition toward the interfacial failure modes. Kirkendall voids do not appear to affect the tensile strength of the joint. The volume change of Ni-P phase transformation during the thermal aging process generates high tensile stress inside the Ni-P layer; this stress causes mudflat cracks on the remaining Ni-P coating and also leads to its delamination from the underlying Ni substrate. In general, interfacial reaction and the subsequent growth of Ni3Sn4 intermetallic compound (IMC) layer during solid-state reaction are the main reasons for the decrease of tensile strength of the solder joints. The current study finds there is an empirical linear relation between the solder joint strength and the Ni3Sn4 intermetallic compound (IMC) thickness. Therefore, the IMC thickness may be used as an indication of the joint strength.
author2 School of Materials Science & Engineering
author_facet School of Materials Science & Engineering
He, Min
Chen, Zhong
Qi, Guojun
format Article
author He, Min
Chen, Zhong
Qi, Guojun
author_sort He, Min
title Mechanical strength of thermally aged Sn-3.5Ag/Ni-P solder joints
title_short Mechanical strength of thermally aged Sn-3.5Ag/Ni-P solder joints
title_full Mechanical strength of thermally aged Sn-3.5Ag/Ni-P solder joints
title_fullStr Mechanical strength of thermally aged Sn-3.5Ag/Ni-P solder joints
title_full_unstemmed Mechanical strength of thermally aged Sn-3.5Ag/Ni-P solder joints
title_sort mechanical strength of thermally aged sn-3.5ag/ni-p solder joints
publishDate 2012
url https://hdl.handle.net/10356/94806
http://hdl.handle.net/10220/8158
_version_ 1772826073432588288