Mechanical strength of thermally aged Sn-3.5Ag/Ni-P solder joints

Mechanical strength of thermally aged Sn-3.5Ag/Ni-P solder joints

This work presents an investigation on the influence of the solder/under bump metallization (UBM) interfacial reaction to the tensile strength and fracture behavior of Sn-3.5Ag/Ni-P solder joints under different thermal aging conditions. The tensile strength of Sn-3.5Ag/Ni-P solder joints decreases...

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書目詳細資料
Main Authors:	He, Min, Chen, Zhong, Qi, Guojun
其他作者:	School of Materials Science & Engineering
格式:	Article
語言:	English
出版:	2012
主題:	DRNTU::Engineering::Materials
在線閱讀:	https://hdl.handle.net/10356/94806 http://hdl.handle.net/10220/8158
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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