Morphology and mechanical properties of intermetallic compounds in SnAgCu solder joints

• Main Authors: Chandra Rao, B.S.S., Weng, J., Shen, L., Lee, T.K., Zeng, K.Y.
• 其他作者: MECHANICAL ENGINEERING
• 格式: Article
• 出版: 2014
• 主題: Elastic modulus; Hardness; Intermetallics; Lead-free solder joints; Nanoindentation
• 在線閱讀: http://scholarbank.nus.edu.sg/handle/10635/85436
• 機構: National University of Singapore

10.1016/j.mee.2010.04.017