Morphology and mechanical properties of intermetallic compounds in SnAgCu solder joints
10.1016/j.mee.2010.04.017
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Main Authors: | Chandra Rao, B.S.S., Weng, J., Shen, L., Lee, T.K., Zeng, K.Y. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Article |
Published: |
2014
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Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/85436 |
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Institution: | National University of Singapore |
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