Morphology and mechanical properties of intermetallic compounds in SnAgCu solder joints

Morphology and mechanical properties of intermetallic compounds in SnAgCu solder joints

10.1016/j.mee.2010.04.017

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Bibliographic Details
Main Authors: Chandra Rao, B.S.S., Weng, J., Shen, L., Lee, T.K., Zeng, K.Y.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Elastic modulus
Hardness
Intermetallics
Lead-free solder joints
Nanoindentation
Online Access:http://scholarbank.nus.edu.sg/handle/10635/85436
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/85436

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