Correlation between intermetallic thickness and roughness during solder reflow

Correlation between intermetallic thickness and roughness during solder reflow

10.1007/BF02657724

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Bibliographic Details
Main Authors: Zuruzi, A.S., Lahiri, S.K., Burman, P., Siow, K.S.
Other Authors: STATISTICS & APPLIED PROBABILITY
Format: Article
Published: 2014
Subjects:
Intermetallic
roughness
solders
Online Access:http://scholarbank.nus.edu.sg/handle/10635/105075
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/105075

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