Correlation between intermetallic thickness and roughness during solder reflow

10.1007/BF02657724

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Bibliographic Details
Main Authors:	Zuruzi, A.S., Lahiri, S.K., Burman, P., Siow, K.S.
Other Authors:	STATISTICS & APPLIED PROBABILITY
Format:	Article
Published:	2014
Subjects:	Intermetallic roughness solders
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/105075
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-105075
record_format	dspace
spelling	sg-nus-scholar.10635-1050752023-10-26T20:20:01Z Correlation between intermetallic thickness and roughness during solder reflow Zuruzi, A.S. Lahiri, S.K. Burman, P. Siow, K.S. STATISTICS & APPLIED PROBABILITY Intermetallic roughness solders 10.1007/BF02657724 Journal of Electronic Materials 30 8 997-1000 JECMA 2014-10-28T05:11:05Z 2014-10-28T05:11:05Z 2001-08 Article Zuruzi, A.S., Lahiri, S.K., Burman, P., Siow, K.S. (2001-08). Correlation between intermetallic thickness and roughness during solder reflow. Journal of Electronic Materials 30 (8) : 997-1000. ScholarBank@NUS Repository. https://doi.org/10.1007/BF02657724 03615235 http://scholarbank.nus.edu.sg/handle/10635/105075 000170458500016 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Intermetallic roughness solders
spellingShingle	Intermetallic roughness solders Zuruzi, A.S. Lahiri, S.K. Burman, P. Siow, K.S. Correlation between intermetallic thickness and roughness during solder reflow
description	10.1007/BF02657724
author2	STATISTICS & APPLIED PROBABILITY
author_facet	STATISTICS & APPLIED PROBABILITY Zuruzi, A.S. Lahiri, S.K. Burman, P. Siow, K.S.
format	Article
author	Zuruzi, A.S. Lahiri, S.K. Burman, P. Siow, K.S.
author_sort	Zuruzi, A.S.
title	Correlation between intermetallic thickness and roughness during solder reflow
title_short	Correlation between intermetallic thickness and roughness during solder reflow
title_full	Correlation between intermetallic thickness and roughness during solder reflow
title_fullStr	Correlation between intermetallic thickness and roughness during solder reflow
title_full_unstemmed	Correlation between intermetallic thickness and roughness during solder reflow
title_sort	correlation between intermetallic thickness and roughness during solder reflow
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/105075
_version_	1781787985357832192

Correlation between intermetallic thickness and roughness during solder reflow

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