Micromechanical Behaviour of Lead-free Solder Joints Developed for 3D-IC Packaging Applications
Ph.D
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| Main Author: | |
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| Other Authors: | |
| Format: | Theses and Dissertations |
| Language: | English |
| Published: |
2013
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| Online Access: | http://scholarbank.nus.edu.sg/handle/10635/37602 |
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| Institution: | National University of Singapore |
| Language: | English |